Powering the Future of Technology

Semiconductor Production
Electronic Analysis
Secure Transaction Chip

About Us

The importance of Leadership

All stages of the semiconductor and electronics manufacturing process, from research and development to manufacturing and packaging, are challenged by the possibility of trace level chemical contaminations or particulates in the process, which will result in reliability issues or failure in the final product, as consumers continue to demand smaller, lighter, and safer electronic devices.

R&D managers for semiconductors, or integrated circuitry (IC), must prepare for full-scale production by creating downstream process standards that will affect the fabrication of devices, the use of fine chemicals, QA/QC techniques and equipment, and testing for components used in assembly, housing, and packaging. In order to identify ppt and ppq impurities while maintaining round-the-clock manufacturing operations, semiconductor, display device, and electronics manufacturing facilities require simple, high-sensitivity solutions.

Our company has a strong global presence, with manufacturing facilities, R&D centers, and offices strategically located across key regions in europe.

This network enables us to provide innovative solutions, meet diverse market demands, and ensure reliable support for our clients wherever they are.

Our Expertise

We pride ourselves on our deep expertise and commitment to delivering innovative, high-quality solutions. Our team brings together industry-leading skills and experience across a broad range of specialties, enabling us to meet the diverse needs of our clients effectively and efficiently.

Innovation & Development

See More

Innovation & Development

In semiconductor manufacturing, innovation and development are the core drivers that enable advancements in technology, ensuring the production of smaller, faster, and more efficient chips. These efforts are essential to meeting the ever-increasing demands of industries such as automotive, telecommunications, consumer electronics, and renewable energy. The following key areas highlight the essence of innovation and development in semiconductor manufacturing:

  1. Process Shrink and Node Scaling
  2. Materials Research
  3. AI-Driven Design and Production
  4. 3D Chip Stacking and Packaging
  5. Sustainability and Energy Efficiency
  6. Collaborative R&D Ecosystems
  7. Automated and Precision Manufacturing
Semiconductor Processing

See More

Semiconductor Processing

Semiconductor processing refers to the highly precise and intricate series of steps used to manufacture semiconductor devices, such as microchips, transistors, and integrated circuits (ICs). These devices are critical to modern electronics, powering everything from smartphones and computers to vehicles and renewable energy systems. Below is an overview of the semiconductor processing stages:

  1. Wafer Preparation
  2. Photolithography
  3. Doping and Ion Implantation
  4. Deposition
  5. Etching
  6. Chemical Mechanical Planarization
  7. Metallization
  8. Packaging and Assembly
Quality Assurance & Control

See More

Quality Assurance & Control

Quality Assurance (QA) and Quality Control (QC) are critical processes in semiconductor manufacturing to ensure the reliability, performance, and durability of semiconductor devices. Given the intricate and high-precision nature of semiconductor production, maintaining stringent quality standards is essential to meet the demands of advanced applications like AI, telecommunications, and automotive systems.

  1. Materials Inspection
  2. Process Monitoring
  3. Functional Testing
  4. Defect Analysis & Failure Detection
  5. Final Product Inspection
  6. Compliance with International Standards
Component Packaging

See More

Component Packaging

Component packaging is a crucial process in semiconductor manufacturing that protects delicate semiconductor chips and ensures their proper functionality, connectivity, and reliability in electronic devices. The package serves as a medium for the chip to interact with external circuits while shielding it from environmental hazards like moisture, heat, and physical damage.
Types of Semiconductor Packaging:

  1. Dual In-line Package (DIP)
  2. Quad Flat Package (QFP)
  3. Ball Grid Array (BGA)
  4. Chip-Scale Package (CSP)
  5. System-in-Package (SiP)
  6. Wafer-Level Packaging (WLP)

Our Solutions

Become an investor?

Join us in shaping the future by investing in groundbreaking technologies and innovations.

Join Us Today

Our Location

Headquarter

Enzberger Str. 30, Niefern-Öschelbronn, 75223, Germany

support@possehlsemiconductors.com

Please Submit Your Query